Intel Launches $1 Billion Fund to Build a Foundry Innovation Ecosystem :: Intel Corporation (INTC)


With the advent of advanced 3D packaging technologies, chip architects are increasingly adopting a modular approach to design – moving from a system on a chip to a system architecture on a package. This provides a way to separate complex semiconductors into modular blocks called “chips”. (Credit: Intel Corporation)





The new fund will strengthen Intel’s foundry business and will encourage the adoption of disruptive technologies.

Santa Clara, California – (BUSINESS WIRE) –
What’s new: Today, Intel announced the creation of a new $ 1 billion fund to support early-stage startups and established companies that are creating disruptive technologies for the foundry ecosystem. As part of a collaboration between Intel Capital and Intel Foundry Services (IFS), the fund will prioritize investing in opportunities that accelerate customer time to market – including intellectual property (IP), software tools, innovative chip architectures and cutting-edge technology. packaging. Intel has also announced partnerships with several companies working with the fund and focused on key strategic areas: building modular products with an open chipset platform and supporting design approaches that use multi-instruction architectures (ISAs) covering x86, Arm and RISC. -V.

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With the advent of advanced 3D packaging technologies, chip architects are increasingly adopting a modular approach to design - moving from a system on a chip to a system architecture on a package.  This provides a way to separate complex semiconductors into modular blocks called “chips”.  (Credit: Intel Corporation)

With the advent of advanced 3D packaging technologies, chip architects are increasingly adopting a modular approach to design – moving from a system on a chip to a system architecture on a package. This provides a way to separate complex semiconductors into modular blocks called “chips”. (Credit: Intel Corporation)

“Customers of foundries are rapidly adopting a modular approach to design to differentiate their products and speed up time to market. Intel Foundry Services is well positioned to lead this major industry breakthrough. With our new investment fund and open chipboard platform, we can help the ecosystem develop disruptive technologies across a range of chip architectures. ”

– Pat Gelsinger, CEO of Intel

How it works: As a key part of its IDM 2.0 strategy, Intel recently created IFS to help meet the growing global demand for advanced semiconductor manufacturing. In addition to providing advanced packaging technology and process and dedicated capabilities in the US and Europe, IFS can offer the widest portfolio of differentiated IPs in the foundry industry, including all leading ISAs.

A robust ecosystem is crucial to help foundry customers bring their projects to life using IFS technology. The new Innovation Fund was created to strengthen the ecosystem in three ways:

  • Investing in joint stock companies in subversive startups.

  • Strategic investments to accelerate the expansion of the partnership.

  • Invest in an ecosystem to develop destructive capabilities to support IFS customers.

“Intel is an innovation hub, but we know that not all good ideas come from our four walls,” said Randhir Thakur, president of Intel Foundry Services. “Innovation thrives in an open and collaborative environment. The $ 1 billion fund, in partnership with Intel Capital, a recognized leader in venture capital, will use all of Intel’s resources to drive innovation in the foundry ecosystem. ”

Saff Yeboa, senior vice president and director of strategy at Intel, said: “Intel Capital’s history and experience are based on chips. Over the past 30 years, we have invested more than $ 5 billion in 120 companies that support the semiconductor manufacturing ecosystem, from materials coming out of the ground to software tools used to implement the project. Our investments, ranging from early-stage company rates to deep strategic and collaborative investments, drive innovation in architecture, IP, materials, equipment and design. ”

About the open ecosystem RISC-V: A key part of IFS’s strategy is to offer a wide range of leading IPs optimized for Intel’s process processes. IFS is the only foundry to offer optimized IP for all three leading ISAs in the industry: x86, Arm and RISC-V.

As a leading open source ISA, RISC-V offers a level of scalability and customization that is unique in the industry. There is a great demand from foundry customers to support more RISC-V IPs. As part of the new innovation fund, Intel is planning investments and proposals that will strengthen the ecosystem and help further the adoption of RISC-V. The fund will help destructive RISC-V companies innovate faster through IFS, collaborate on collaborative technology optimization, prioritize waffle shuttles, support customer projects, create fees for software development and infrastructure, and more.

Intel is teaming up with leading partners in the RISC-V ecosystem, including Andes Technology, Esperanto Technologies, SiFive and Ventana Micro Systems. IFS plans to offer a range of proven RISC-V IP cores optimized for different market segments. By collaborating with leading vendors, IFS will optimize IP for Intel processes to ensure that RISC-V works best on IFS silicon in all core types, from embedded to high-performance. Three types of RISC-V proposals will be available:

  • Partner products made by IFS technologies.

  • The RISC-V kernel is licensed as a differentiated IP.

  • RISC-V-based chip building blocks, using modern packaging and high-speed chip-to-chip interfaces.

To learn more about how IFS catalyzes the RISC-V ecosystem with leading partners, see the Information Sheet: Catalyzing the RISC-V Ecosystem.

In addition to hardware and IP, the rich open source software ecosystem is critical to accelerating the growth and adoption of the RISC-V processor and complete unlocking of value for chip developers. IFS will sponsor an open source software development platform that gives freedom in experimentation, including ecosystem partners, universities and consortia. To further develop this program, the company today announced that it is joining RISC-V International, a global non-profit organization that supports a free and open architecture and expanding RISC-V instruction set.

“I’m excited that Intel, a pioneer in microprocessors 50 years ago, is now a member of RISC-V International,” said David Patterson, Honorary Professor at the University of California, Berkeley, an outstanding Google engineer and vice chairman. RISC-V International.

About the open Chiplet platform: With the advent of advanced 3D packaging technologies, chip architects are increasingly adopting a modular approach to design – moving from a system on a chip to a system architecture on a package. This provides a way to separate complex semiconductors into modular blocks called “chips”. Each unit is customizable for a specific feature, providing designers with incredible flexibility to mix and match the best IP and technology technologies to apply the product. The ability to reuse IP also shortens development cycles and reduces the time and cost of product launch.

Although there are opportunities in many segments, the data center market is one of the first to adopt a modular architecture. Many cloud service providers (CSPs) are looking to create custom computing machines that include accelerators, in order to improve data center performance for workloads such as artificial intelligence. Tightly integrating accelerator chips into the same CPU package allows for much higher performance and less power compared to placing accelerator cards next to CPU boards.

The true use of the power of modular architecture requires an open ecosystem, as this approach combines IP design and technology technologies from different vendors. IFS enables this ecosystem through an open-ended chipboard platform developed in conjunction with CSP to accelerate the integration of the platform and client-side IP accelerator packages. The platform will leverage Intel’s advanced packaging capabilities with IP optimized for advanced IFS processes, combined with services to accelerate customer time to market through integration and validation.

In addition, Intel is looking to collaborate with other industry leaders to develop an open standard for interconnections that allow chips to communicate with each other at high speeds. Using the solid experience of widespread standards – such as USB, PCI Express and CXL – the industry can create a new open ecosystem that will allow the packaging of compatible chiplets from different foundries and processing units using a variety of technologies.

The new open chipboard platform is gaining momentum with customers who appreciate the ability to quickly integrate accelerators optimized for new and evolving data center workloads.

More context: Innovation starts here: Foundry Ecosystem Partnership (edited by Randhir Thakura) | Catalyzing the RISC-V Ecosystem (Information Information) Intel Foundry Services | Intel Foundry Services launches Ecosystem Alliance to accelerate customer innovation

About Intel

Intel (Nasdaq: INTC) is a leader in the industry, creating world-changing technology that delivers global progress and enriches life. Inspired by Moore’s Law, we are constantly working to promote the design and manufacture of semiconductors to help solve our customers ’biggest problems. By embedding intelligence in the cloud, network, edge and any computing device, we unleash the potential of data to transform business and society for the better. To learn more about Intel’s innovation, go to newsroom.intel.com and intel.com.

© Intel Corporation. Intel, the Intel logo and other Intel marks are trademarks of Intel Corporation or its subsidiaries. Other names and brands may be claimed as the property of others.

Jason Gors

1-518-698-7765

jason.gorss@intel.com

Source: Intel Corporation

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