Aiming to significantly reduce the area of microchip placement units and improve overall silicon yield
SAN DIEGO, February 15, 2022 (GLOBE NEWSWIRE) – GBT Technologies Inc. (OTC PINK: GTCH ) (“GBT” or “Company”), develops technology using artificial intelligence to automatically seal integrated circuit (IC) layout units. The area of silicon and increase its yield. It is expected that microchips will include more functionality, consume less power, decrease in size and ultimately be cheaper. The semiconductor field expands the envelope by introducing smaller manufacturing processes, scaling to deep nanometer ranges. Scaling the manufacturing process allows for billions of transistors on crystals, higher performance and reduced power consumption, but introduces new design challenges due to complex physics rules. IC projects can take longer as they have to comply with a huge number of complex rules and restrictions. The company’s position is that the automatic layout layout technology IC can be an effective way to reduce the size of new and existing layout IP addresses u Ilizing a smaller area of silicon in order to increase the overall yield.
The main purpose of the sealing process is to create the most dense layout of the IC. GBT is now developing technology using artificial intelligence to read existing and new microchip placement data in order to create the most dense layout block. The technology aims to optimize IP addresses after deployment, automatically reducing them while maintaining the geometric design rule and the correctness of the electrical connection. In addition, the goal of a computer program is to maintain the constraints of Design for Manufacturing (DFM) to conform to the manufacturing process. The design of the technology involves the introduction of optimization algorithms based on schedules and in-depth training for fast processing and optimal use of space.
The technology is designed for analog, digital, radio frequency and mixed style integrated circuits to support GDSII and Oasis data.
Due to the ever-growing size and complexity of microchips, there is an urgent need for electronic design automation (EDA) solutions to reduce IC size and increase performance while reducing cost. GBT believes that the use of intelligent IP block compaction technology can achieve these goals.
“Today’s microchips include billions of transistors that have a significant impact on the overall chip crystal size. Because of the greater silicon “real estate,” designers have to face more complex challenges in electricity and performance. The industry is constantly shortening the manufacturing process, reaching deep nanometer ranges that create more complex physics-related problems. We believe that efficient layout sealing technology can be an excellent functional and cost-effective solution for existing and new IP units. We are now developing artificial intelligence-based technology to read the existing IC layout unit and compact it to as dense a size as possible. The process aims to ensure that it is carried out automatically and in a short time. We strive to develop a program to comply with process design rules, DFM recommendations, and electrical connections. This is to ensure that the entire silicon area is significantly reduced and thus increase silicon yield and ultimately reduce the cost of chips. The technology is planned to support old and advanced nanometer processes, analog, digital, radio and mixed styles, making it a flexible tool for all types of firms involved in chip design. As integrated circuit technology improves, more functionality, lower power consumption, higher performance and lower cost are in high demand, especially in advanced nanometer projects, ”said Danny Ritman, CTO.
There is no guarantee that the Company will be successful in researching, developing or implementing this system. In order to successfully implement this concept, the Company will need to raise sufficient capital to support its research, and, in the case of successful research, development and regulatory approval, the Company will need to enter into a strategic relationship with a third party experienced in production, sale and distribution of this product. There is no guarantee that the Company will be successful in any or all of these critical steps.
GBT Technologies, Inc. (OTC PINK: GTCH) (“GBT”) (http://gbtti.com) is a company under development that considers itself to come from the Internet of Things (IoT), Artificial Intelligence (AI) and Enabled Mobile Technology Platforms, which used to improve chip performance. GBT has assembled a team with extensive experience in technology and is building a portfolio of intellectual property consisting of many patents. GBT ‘s mission is to license technology and IP to synergy partners in hardware and software. Post-commercialization GBT aims to have a suite of products including smart microchips, artificial intelligence, encryption, blockchain, IC design, mobile security applications, database management protocols with tracking and support for cloud software (without the need for GPS). GBT views this system as building a global cellular network using advanced nodes and next-generation super-productive IC technology. The core of the system will be its advanced microchip technology; technology that can be installed in any mobile or stationary device worldwide. GBT’s vision is to create this system as a low cost, secure private cellular network between all enabled devices. Thus, providing collaborative processing, advanced mobile phone database management and sharing when using these advanced mobile features as an alternative to traditional operator services.
Statements about the future
Some of the statements contained in this press release may be “forward-looking statements”. Forward-looking statements provide current expectations of future events based on certain assumptions and include any statement that is not directly related to any historical or current facts. Actual results may differ materially from those stated in such forward-looking statements due to various important factors that are disclosed in our documents to the Securities and Exchange Commission located on their website (http://www.sec.gov ). In addition to these factors, actual future performance, results and outcomes may differ significantly due to more general factors including (without limitation) general industry and market conditions and growth rates, economic conditions, changes in government and government policies, the company’s ability to raise capital on acceptable terms, if at all, the successful development of the Company’s products and the integration into its existing products and the commercial acceptance of the company’s products. The forward-looking statements included in this press release represent the company’s opinion at the date of this press release, and these views are subject to change. However, while the Company may decide to update these forward-looking statements at some point in the future, the Company specifically waives any commitment to do so. These forward-looking statements should not be relied upon as that they represent the company’s opinion on any date after the press release date.
Dr. Danny Ritman, Technical Director